Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11345813 | Resin composition, pre-preg, metal-clad laminate, and printed circuit board using the same | Shur-Fen Liu | 2022-05-31 |
| 11312829 | Flexible prepreg and uses thereof | Shur-Fen Liu | 2022-04-26 |
| 11124613 | Resin composition and uses of the same | Shur-Fen Liu | 2021-09-21 |
| 11124614 | Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the same | Shur-Fen Liu, Meng-Huei Chen | 2021-09-21 |
| 11015052 | Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same | Shur-Fen Liu | 2021-05-25 |
| 10836919 | Solvent-free resin composition and uses of the same | Shur-Fen Liu | 2020-11-17 |
| 10662352 | Adhesive composition and uses of the same | Shur-Fen Liu | 2020-05-26 |
| 10575401 | Dielectric composite and uses thereof | Shur-Fen Liu, Wei Yang, Chang Liu | 2020-02-25 |
| 10246588 | Solvent-free resin composition and uses of the same | Shur-Fen Liu | 2019-04-02 |
| 8488299 | Capacitor structure | Shih-Hsien Wu, Min-Lin Lee, Shinn-Juh Lai, Shur-Fen Liu, Meng-Hua Chen | 2013-07-16 |