Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7642658 | Pad structure to prompt excellent bondability for low-k intermetal dielectric layers | Tze-Liang Lee | 2010-01-05 |
| 6955981 | Pad structure to prompt excellent bondability for low-k intermetal dielectric layers | Tze-Liang Lee | 2005-10-18 |