Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812569 | Semiconductor device and fabricating method thereof | I-Chih Chen, Ying-Lang Wang, Chih-Mu Huang, Wen-Chang Kuo, Jung-Chi Jeng | 2017-11-07 |
| 9768221 | Pad structure layout for semiconductor device | Shang-Yen Wu, I-Chih Chen, Yi-Sheng Liu, Volume Chien, Fu-Tsun Tsai +1 more | 2017-09-19 |
| 9728511 | Semiconductor wafer and semiconductor die | Hsi-Jung Wu, Volume Chien, Ying-Lang Wang, Hsin-Chi Chen, Hung-Ta Huang | 2017-08-08 |
| 9728637 | Mechanism for forming semiconductor device with gate | Jung-Chi Jeng, I-Chih Chen, Wen-Chang Kuo, Ru-Shang Hsiao, Chih-Mu Huang | 2017-08-08 |
| 9659859 | Metal pad offset for multi-layer metal layout | I-Chih Chen, Chi-Cherng Jeng, Volume Chien, Fu-Tsun Tsai, Kun-Huei Lin | 2017-05-23 |
| 9281215 | Mechanism for forming gate | Jung-Chi Jeng, I-Chih Chen, Wen-Chang Kuo, Ru-Shang Hsiao, Chih-Mu Huang | 2016-03-08 |
| 9252180 | Bonding pad on a back side illuminated image sensor | Volume Chien, I-Chih Chen, Ying-Lang Wang, Hsin-Chi Chen, Hung-Ta Huang | 2016-02-02 |
| 9093430 | Metal pad offset for multi-layer metal layout | I-Chih Chen, Chi-Cherng Jeng, Volume Chien, Fu-Tsun Tsai, Kun-Huei Lin | 2015-07-28 |