Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283568 | Wafer bonding alignment | Hsi-Cheng Hsu, Jui-Chun Weng, Ching-Hsiang Hu, Ji-Hong Chiang, Kuo-Hao Lee +4 more | 2025-04-22 |
| 11742320 | Wafer bonding alignment | Hsi-Cheng Hsu, Jui-Chun Weng, Ching-Hsiang Hu, Ji-Hong Chiang, Kuo-Hao Lee +4 more | 2023-08-29 |