YS

Yea-Zan Su

TSMC: 1 patents #8,466 of 12,232Top 70%
📍 Baoshan, TW: #2,187 of 3,661 inventorsTop 60%
Overall (All Time): #3,466,970 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6677228 Reinforced aluminum copper bonding pad Cheng-Chung Huang, Huai-Jen Hsu, Wen-Tsan Chang 2004-01-13