Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426270 | 3D memory multi-stack connection method | Chia-En Huang, Meng-Han Lin | 2025-09-23 |
| 11758733 | 3D memory multi-stack connection method | Chia-En Huang, Meng-Han Lin | 2023-09-12 |
| 7154750 | Printed circuit board having cooling means incorporated therein | Nien-Lun Li, Fu-Yin Wang, Jian-Xuan Lee | 2006-12-26 |