Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7358549 | Multi-layered metal routing technique | — | 2008-04-15 |
| 7012020 | Multi-layered metal routing technique | — | 2006-03-14 |
| 6084266 | Layout of semiconductor devices to increase the packing density of a wafer | — | 2000-07-04 |
| 5998846 | Layout structure of multi-use coupling capacitors in reducing ground bounces and replacing faulty logic components | Yen-Tai Lin | 1999-12-07 |