Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11851224 | Integrated semiconductor die parceling platforms | Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Yang-Ann Chu, Chieh-Chun Lin | 2023-12-26 |
| 11299302 | Integrated semiconductor die parceling platforms | Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Yang-Ann Chu, Chieh-Chun Lin | 2022-04-12 |