Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261095 | Semiconductor package having an encapulant comprising conductive fillers and method of manufacture | Xinyu BAO, Lee-Chung Lu, Jyh Chwen Frank Lee, Fong-Yuan Chang, Po-Hsiang Huang | 2025-03-25 |
| 11908690 | Multi-layered semiconductive device and methodology with polymer and transition metal dichalcogenide material | Alwin S. Daus, Eric Pop | 2024-02-20 |
| 11842946 | Semiconductor package having an encapsulant comprising conductive fillers and method of manufacture | Xinyu BAO, Lee-Chung Lu, Jyh Chwen Frank Lee, Fong-Yuan Chang, Po-Hsiang Huang | 2023-12-12 |