Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381081 | Method of breaking through etch stop layer | Yu-Shih Wang, Hong-Jie Yang, Chia-Ying Lee, U-Ting Chiu, Chun-Neng Lin +2 more | 2025-08-05 |
| 12272598 | Conductive feature of a semiconductor device | U-Ting Chiu, Yu-Shih Wang, Chun-Neng Lin, Ming-Hsi Yeh | 2025-04-08 |
| 12224204 | Semiconductor device and method | Yu-Shih Wang, Ming-Hsi Yeh | 2025-02-11 |
| 12136566 | Semiconductor device and method of manufacture | Yu-Shih Wang, U-Ting Chiu, Chun-Neng Lin, Chia-Cheng Chen, Liang-Yin Chen +2 more | 2024-11-05 |
| 12051619 | Semiconductor device and method of manufacture | Yu-Shih Wang, U-Ting Chiu, Chun-Neng Lin, Chia-Cheng Chen, Liang-Yin Chen +2 more | 2024-07-30 |
| 11996324 | Conductive feature of a semiconductor device and method of forming same | U-Ting Chiu, Yu-Shih Wang, Chun-Neng Lin, Ming-Hsi Yeh | 2024-05-28 |
| 11901180 | Method of breaking through etch stop layer | Yu-Shih Wang, Hong-Jie Yang, Chia-Ying Lee, U-Ting Chiu, Chun-Neng Lin +2 more | 2024-02-13 |
| 11488857 | Semiconductor device and method of manufacture using a contact etch stop layer (CESL) breakthrough process | Yu-Shih Wang, U-Ting Chiu, Chun-Neng Lin, Chia-Cheng Chen, Liang-Yin Chen +2 more | 2022-11-01 |
| 11488859 | Semiconductor device and method | Yu-Shih Wang, Ming-Hsi Yeh | 2022-11-01 |
| 11424185 | Semiconductor device and manufacturing method thereof | Cheng-Wei Chang, Chia-Hung Chu, Kao-Feng Lin, Hsu-Kai Chang, Shuen-Shin Liang +6 more | 2022-08-23 |
| 11276571 | Method of breaking through etch stop layer | Yu-Shih Wang, Hong-Jie Yang, Chia-Ying Lee, U-Ting Chiu, Chun-Neng Lin +2 more | 2022-03-15 |
| 11195752 | Semiconductor device and method of forming same | Yu-Shih Wang, Kuo-Bin Huang, Ming-Hsi Yeh | 2021-12-07 |