Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422470 | Semiconductor packages with through via structures and methods for testing the same | Ying-Chih Hsu, Jui-Cheng Huang, Wei-Tao Shaw | 2025-09-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422470 | Semiconductor packages with through via structures and methods for testing the same | Ying-Chih Hsu, Jui-Cheng Huang, Wei-Tao Shaw | 2025-09-23 |