IC

I-Chih Chen

TSMC: 35 patents #964 of 12,232Top 8%
TL Tsmc Nanjing Company, Limited: 5 patents #20 of 113Top 20%
VT Via Technologies: 1 patents #566 of 1,108Top 55%
📍 Tainan, TW: #136 of 4,566 inventorsTop 3%
Overall (All Time): #91,986 of 4,157,543Top 3%
36
Patents All Time

Issued Patents All Time

Showing 26–36 of 36 patents

Patent #TitleCo-InventorsDate
9865731 Semiconductor device and manufacturing method thereof Ying-Lang Wang, Chih-Mu Huang, Ying-Hao Chen, Wen-Chang Kuo, Jung-Chi Jeng 2018-01-09
9812569 Semiconductor device and fabricating method thereof Ying-Lang Wang, Chih-Mu Huang, Ying-Hao Chen, Wen-Chang Kuo, Jung-Chi Jeng 2017-11-07
9768221 Pad structure layout for semiconductor device Shang-Yen Wu, Yi-Sheng Liu, Volume Chien, Fu-Tsun Tsai, Chi-Cherng Jeng +1 more 2017-09-19
9728637 Mechanism for forming semiconductor device with gate Jung-Chi Jeng, Wen-Chang Kuo, Ying-Hao Chen, Ru-Shang Hsiao, Chih-Mu Huang 2017-08-08
9728598 Semiconductor device having barrier layer to prevent impurity diffusion Chih-Mu Huang, Fu-Tsun Tsai, Meng-Yi Wu, Yung-Fa Lee, Ying-Lang Wang 2017-08-08
9659859 Metal pad offset for multi-layer metal layout Ying-Hao Chen, Chi-Cherng Jeng, Volume Chien, Fu-Tsun Tsai, Kun-Huei Lin 2017-05-23
9490345 Semiconductor device and manufacturing method thereof Fu-Tsun Tsai, Yung-Fa Lee, Ko-Min Lin, Chih-Mu Huang, Ying-Lang Wang 2016-11-08
9450093 Semiconductor device structure and manufacturing method thereof Chih-Ming Hsieh, Fu-Tsun Tsai, Yung-Fa Lee, Chih-Mu Huang 2016-09-20
9281215 Mechanism for forming gate Jung-Chi Jeng, Wen-Chang Kuo, Ying-Hao Chen, Ru-Shang Hsiao, Chih-Mu Huang 2016-03-08
9252180 Bonding pad on a back side illuminated image sensor Volume Chien, Ying-Lang Wang, Hsin-Chi Chen, Ying-Hao Chen, Hung-Ta Huang 2016-02-02
9093430 Metal pad offset for multi-layer metal layout Ying-Hao Chen, Chi-Cherng Jeng, Volume Chien, Fu-Tsun Tsai, Kun-Huei Lin 2015-07-28