Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943820 | Gap-fill method having improved gap-fill capability | Wan-Yi Kao, Wei LI, Chung-Chi Ko, Yu-Cheng Shiau, Chih-Tang Peng +1 more | 2021-03-09 |
| 10186454 | Semiconductor structure having etch stop layer and method of forming the same | Cheng-Han Lin, Chao-Ching Chang, Jian-Shin Tsai, Yi-Ming Lin, Min-Hui Lin | 2019-01-22 |