FL

Fang-Shi Jordan Lai

TSMC: 23 patents #1,475 of 12,232Top 15%
IBM: 3 patents #26,272 of 70,183Top 40%
📍 Kaohsiung, NY: #3 of 6 inventorsTop 50%
Overall (All Time): #154,417 of 4,157,543Top 4%
26
Patents All Time

Issued Patents All Time

Showing 26–26 of 26 patents

Patent #TitleCo-InventorsDate
4475982 Deep trench etching process using CCl.sub.2 F.sub.2 /Ar and CCl.sub.2 F.sub. /O.sub.2 RIE Ronald N. Schulz 1984-10-09