Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400948 | Structure and method for interlevel dielectric layer with regions of differing dielectric constant | — | 2025-08-26 |
| 12363987 | Partial metal grain size control to improve CMP loading effect | Yen-Yu Chen, Fang-Ting Kuo | 2025-07-15 |
| 12218181 | Barrier layer for metal insulator metal capacitors | Fang-Ting Kuo, Yen-Yu Chen | 2025-02-04 |
| 12211890 | Barrier layer for metal insulator metal capacitors | Fang-Ting Kuo, Yen-Yu Chen | 2025-01-28 |
| 12166104 | Gate structure and methods thereof | Fang-Ting Kuo | 2024-12-10 |
| 12074024 | Semiconductor devices and methods of manufacturing thereof | Chung-Lei Chen, Meng-I Kang, Yen-Liang Lin | 2024-08-27 |
| 12027447 | Semiconductor device having a dual material redistribution line | Chun-Chang Liu | 2024-07-02 |
| 11978781 | Partial metal grain size control to improve CMP loading effect | Fang-Ting Kuo, Yen-Yu Chen | 2024-05-07 |
| 11955421 | Structure and method for interlevel dielectric layer with regions of differing dielectric constant | — | 2024-04-09 |
| 11799014 | Gate structure and methods thereof | Fang-Ting Kuo | 2023-10-24 |
| 11410882 | Method of forming semiconductor device having a dual material redistribution line and semiconductor device | Chun-Chang Liu | 2022-08-09 |
| 11373970 | Semiconductor device having a redistribution line | Chun-Chang Liu, Sheng-Wei Yeh | 2022-06-28 |
| 11227935 | Gate structure and methods thereof | Fang-Ting Kuo | 2022-01-18 |
| 10811314 | Method of forming semiconductor device having a dual material redistribution line | Chun-Chang Liu | 2020-10-20 |
| 10541218 | Redistribution layer structure and fabrication method therefor | Chun-Chang Liu, Sheng-Wei Yeh | 2020-01-21 |
| 10431664 | Gate structure and methods thereof | Fang-Ting Kuo | 2019-10-01 |
| 9991189 | Semiconductor device having a dual material redistribution line | Chun-Chang Liu | 2018-06-05 |