Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121684 | Manufacturing method, pickup method, equipment and EMI (electromagnetic interference) electromagnetic shielding layer manufacturing method of SiP (system in package) module | Bin Wu | 2018-11-06 |
| 9260884 | Lock cylinder capable of changing a key member | Shih-Min Lu | 2016-02-16 |