SC

Sheng-Chin CHAN

TC Tai-Sol Electronics Co.: 1 patents #10 of 19Top 55%
Overall (All Time): #2,935,235 of 4,157,543Top 75%
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Patent #TitleCo-InventorsDate
9593887 Heat dissipation structure with heat pipes arranged in two spaced and partially overlapped layers Yun-Yeu Yeh 2017-03-14