Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10986734 | Method for manufacturing an electromechanical structure and an arrangement for carrying out the method | Mikko Heikkinen, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2021-04-20 |
| 10986735 | Method for manufacturing an electromechanical structure and an arrangement for carrying out the method | Mikko Heikkinen, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2021-04-20 |
| 10960641 | Integrated multilayer structure for use in sensing applications and method for manufacturing thereof | Vinski Bräysy, Anne Isohätälä, Tomi Simula | 2021-03-30 |
| 10946612 | Integrated multilayer structure for use in sensing applications and method for manufacturing thereof | Vinski Bräysy, Anne Isohätälä, Tomi Simula | 2021-03-16 |
| 10827609 | Ecological multilayer structure for hosting electronics and related method of manufacture | Tero Heikkinen, Antti Keränen, Mikko Heikkinen | 2020-11-03 |
| 10813222 | System for manufacturing an electromechanical structure | Mikko Heikkinen, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2020-10-20 |
| 10675834 | Integrated multilayer structure for use in sensing applications and method for manufacturing thereof | Vinski Bräysy, Anne Isohätälä, Tomi Simula | 2020-06-09 |
| 10667401 | Multilayer structure and related method of manufacture for electronics | Mikko Heikkinen, Antti Keränen, Ronald H. Haag | 2020-05-26 |
| 10660211 | Method for manufacturing an electromechanical structure | Mikko Heikkinen, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2020-05-19 |
| 10653004 | Electronic assembly | Mikko Heikkinen | 2020-05-12 |
| 10642433 | Multilayer structure with embedded multilayer electronics | Jarkko Torvinen, Pasi Raappana, Mikko Heikkinen | 2020-05-05 |
| 10575407 | System for carrying out a manufacturing method on an electro chemical structure | Mikko Heikkinen, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2020-02-25 |
| 10561019 | Ecological multilayer structure for hosting electronics and related method of manufacture | Tero Heikkinen, Antti Keränen, Mikko Heikkinen | 2020-02-11 |
| 10485094 | Multilayer structure with embedded sensing functionalities and related method of manufacture | Anne Isohätälä, Hasse Sinivaara, Heikki Tuovinen, Ville Wallenius, Vinski Bräysy +6 more | 2019-11-19 |
| 10383232 | Thermoformed plastic cover for electronics and related method of manufacture | Mikko Heikkinen, Jarkko Torvinen | 2019-08-13 |
| 10314506 | Heart activity sensor structure | Seppo Korkala, Elias Pekonen, Juhani Kemppainen, Pekka Rytky | 2019-06-11 |
| 10285261 | Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the node | Tomi Simula, Vinski Bräysy, Mikko Heikkinen, Juha-Matti Hintikka, Juhani Harvela +3 more | 2019-05-07 |
| 10257925 | Method for manufacturing an electronic assembly | Mikko Heikkinen | 2019-04-09 |
| 10251278 | Multi-material structure with embedded electronics | Mikko Heikkinen | 2019-04-02 |
| 10248277 | Multilayer structure with embedded multilayer electronics | Jarkko Torvinen, Pasi Raappana, Mikko Heikkinen | 2019-04-02 |
| 10234340 | Multilayer structure for capacitive pressure sensing | Kari Severinkangas, Mikko Heikkinen | 2019-03-19 |
| 10225932 | Interfacing arrangement, method for manufacturing an interfacing arrangement, and multilayer structure hosting an interfacing arrangement | Tomi Simula, Vinski Bräysy, Mikko Heikkinen, Juha-Matti Hintikka, Minna Pirkonen +3 more | 2019-03-05 |
| 10194526 | Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the node | Tomi Simula, Vinski Bräysy, Mikko Heikkinen, Juha-Matti Hintikka, Juhani Harvela +3 more | 2019-01-29 |
| 10091887 | Multi-material structure with embedded electronics | Mikko Heikkinen | 2018-10-02 |
| 10064282 | Thermoformed plastic cover for electronics and related method of manufacture | Mikko Heikkinen, Jarkko Torvinen | 2018-08-28 |