Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7449362 | One-component hot-setting epoxy resin composition and semiconductor mounting underfill material | Tatsuya Okuno | 2008-11-11 |
| 6881591 | Underfilling material for semiconductor package | Tatsuya Okuno | 2005-04-19 |
| 6660943 | Underfilling material for semiconductor package | Tatsuya Okuno | 2003-12-09 |
| 5866668 | Heat curable composition | Nobuhiko Maeda, Tatsuya Okuno, Yoshiya Hattori | 1999-02-02 |