Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12359097 | Low bond-temperature hot melt adhesive with high impact strength and chemical resistance | Paul Kurtz, Bo Sun, Philippe Schottland, Jerome Moyer, Saeid Savarmand | 2025-07-15 |