Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11940222 | Heat sink module with through-hole | Shota HANAFUSA | 2024-03-26 |
| 11754344 | Boiling cooler | Shota HANAFUSA, Kenji Ando | 2023-09-12 |
| 11284534 | Cooling device | Ryo Yamaguchi, Kenji Ando | 2022-03-22 |
| 8813832 | Heat sink | Kenji Ando | 2014-08-26 |
| 8330255 | Semiconductor chip | — | 2012-12-11 |
| 8022508 | Semiconductor wafer | — | 2011-09-20 |
| 7728429 | Semiconductor device having recessed connector portions | Isamu Aokura, Toshiyuki Fukuda, Yukitoshi Ota | 2010-06-01 |
| 7279357 | Method for fabricating a chip-scale-packaging (CSP) having an inductor | Nozomi Shimoishizaka, Kazuyuki Kaino, Yoshifumi Nakamura, Kazumi Watase, Ryuichi Sahara | 2007-10-09 |
| 6954001 | Semiconductor device including a diffusion layer | Yoshifumi Nakamura, Ryuichi Sahara, Nozomi Shimoishizaka, Kazuyuki Kainou, Kazumi Watase +1 more | 2005-10-11 |
| 6921583 | Al-Cu bonded structure and method for making the same | Ken-ichi Koyama, Makoto Yoshida, Kenji Shinozaki | 2005-07-26 |
| 6914331 | Semiconductor device having an inductor formed on a region of an insulating film | Nozomi Shimoishizaka, Kazuyuki Kaino, Yoshifumi Nakamura, Kazumi Watase, Ryuichi Sahara | 2005-07-05 |
| 6784557 | Semiconductor device including a diffusion layer formed between electrode portions | Yoshifumi Nakamura, Ryuichi Sahara, Nozomi Shimoishizaka, Kazuyuki Kainou, Kazumi Watase +1 more | 2004-08-31 |
| 6159622 | Galvannealed steel sheet and manufacturing method thereof | Masahiko Hori, Toshio Nakamori | 2000-12-12 |
| 5625229 | Heat sink fin assembly for cooling an LSI package | Masayasu Kojima, Chihiro Hayashi, Tetsuo Abiko | 1997-04-29 |
| 5162279 | Immobilized metal complexes | — | 1992-11-10 |