Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6620650 | Chip package and method for manufacturing the same | Takeshi Kasai | 2003-09-16 |
| 6495394 | Chip package and method for manufacturing the same | Takeshi Kasai | 2002-12-17 |
| 6249053 | Chip package and method for manufacturing the same | Takeshi Kasai | 2001-06-19 |
| 6074893 | Process for forming fine thick-film conductor patterns | Syozo Otomo, Kazunari Tanaka, Koichi Uno | 2000-06-13 |