Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6210548 | Apparatus for partially removing plating films of leadframe | Takashi Kobayashi, Keisuke Wada | 2001-04-03 |
| 4675093 | Selectively plating apparatus for forming an annular coated area | Keisuke Wada | 1987-06-23 |
| 4279682 | Apparatus for securing tape to leads of semiconductor lead frame | Teruaki Hamagami, Fumio Sato | 1981-07-21 |