Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4791031 | Lead frame for IC having a wire bonding part composed of multi-layer structure of iron containing alloy, refractory metal and aluminum | — | 1988-12-13 |
| 4604291 | Method for manufacture of aluminum-coated lead frame | Yen-Ching Huang | 1986-08-05 |