Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9992918 | Method for mounting electronic component | Hideaki Watanabe, Kiyoshi Imai, Shigeki Imafuku | 2018-06-05 |
| 9867320 | Apparatus for mounting electronic component | Hideaki Watanabe, Shigeki Imafuku | 2018-01-09 |
| 9185916 | Method of processing wheat flour, processed wheat flour obtained by the method and food utilizing the processed wheat flour | Masanori Ito, Kazuhiro Sano, Takahiro Kitamura, Koji Murakami | 2015-11-17 |
| 6915561 | Electronic component mounting apparatus | Dai Yokoyama, Hideaki Watanabe, Kiyoshi Imai, Taira Ishii | 2005-07-12 |
| 6715205 | Apparatus for mounting a wire component | Hideaki Watanabe, Dai Yokoyama, Hiromi Kinoshita | 2004-04-06 |
| 6609295 | Component mounting apparatus and device for detecting attachment on component substrate | Satoshi Taniguchi | 2003-08-26 |
| 6561407 | Reflow soldering apparatus and method | Nobuyasu Nagafuku, Akihiko Wachi, Masaya Matsumoto | 2003-05-13 |
| 6382497 | Reflow soldering apparatus and method | Nobuyasu Nagafuku, Akihiko Wachi, Masaya Matsumoto | 2002-05-07 |