Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5254819 | High-frequency heating apparatus with copper for grounding layer surrounding electromagnetic wave antenna | Koji Yoshino, Takashi Kashimoto, Kimiaki Yamaguchi, Shinichi Sakai, Satomi Moriyama | 1993-10-19 |