Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4985529 | Thermosettable imide compound and epoxy resin composition containing the same | Yasuhisa Saito, Shuichi Kanagawa, Kumimasa Kamio | 1991-01-15 |
| 4960860 | Imide compound and composition containing the same | Yasuhisa Saito, Kunimasa Kamio, Mitsuhiro Shibata, Yutaka Shiomi, Youichi Ueda | 1990-10-02 |
| 4957995 | Low-viscosity epoxy resin, and fiber-reinforced composite material based on m-alkyl triglycidylaminophenols | Yasuhisa Saito, Kohichi Okuno, Kunimasa Kamio, Akira Morii | 1990-09-18 |
| 4900848 | Low-viscosity epoxy resin, and fiber-reinforced composite material from triglycidyl m-aminophenols | Yasuhisa Saito, Kohichi Okuno, Kunimasa Kamio, Akira Morii, Hiroshi Nakamura | 1990-02-13 |
| 4888407 | Imide compound and composition containing the same | Saito Yasuhisa, Kunimasa Kamio, Mitsuhiro Shibata, Yutaka Shiomi, Youichi Ueda | 1989-12-19 |
| 4871832 | Thermosettable imide compound and epoxy resin composition containing the same | Yasuhisa Saito, Shuichi Kanagawa, Kunimasa Kamio | 1989-10-03 |
| 4705833 | Thermosettable heat-resistant resin compositions | Yasuhisa Saito, Hisao Takagishi, Kohichi Okuno, Junichi Kenmei, Kunimasa Kamio | 1987-11-10 |