Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8148831 | Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device | Akihiro Horimoto | 2012-04-03 |
| 7442729 | Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt | Akiko Okubo, Yoshihito Akiyama, Hiroshi Hirose, Hirotaka Nonaka, Maki Sugawara | 2008-10-28 |
| 7074738 | Curing accelerator, epoxy resin composition, and semiconductor device | Akiko Okubo, Yoshihito Akiyama, Hiroshi Hirose, Hirotaka Nonaka, Maki Sugawara | 2006-07-11 |
| 6753086 | Thermosetting resin composition, epoxy resin molding material and semiconductor device | Hiroshi Nagata | 2004-06-22 |