Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8748751 | Electronic component package and method for producing electronic component package | Masayoshi Kondo, Satoshi Tanaka, Kenichi Kanemasa | 2014-06-10 |
| 8241760 | Joint structure, joining method, wiring board and method for producing the same | — | 2012-08-14 |
| 7576288 | Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards | Masayoshi Kondo, Masaaki Kato, Satoru Nakao, Kentaro Fujiura | 2009-08-18 |