Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8465837 | Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board | Akihito Takahashi | 2013-06-18 |
| 8294268 | Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device | — | 2012-10-23 |