Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6733901 | Process for production of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device | Kenji Takayama, Kazuo Noda | 2004-05-11 |
| 6495260 | Method of producing epoxy for molding semiconductor device, molding material, and semiconductor device | Kenji Takayama, Yoshiyuki Anai | 2002-12-17 |