Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8969490 | Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device | Michio Kimura, Haruo Murakami | 2015-03-03 |
| 8357859 | Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate | Hiroaki Wakabayashi | 2013-01-22 |
| 8318292 | Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device | — | 2012-11-27 |