Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8709587 | Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board and semiconductor device | — | 2014-04-29 |
| 7291684 | Resin composition for encapsulating semiconductor chip and semiconductor device therewith | Shigehisa Ueda | 2007-11-06 |
| 7023098 | Resin composition for encapsulating semiconductor chip and semiconductor device therewith | Shigehisa Ueda | 2006-04-04 |