Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8178599 | Composition of epoxy resin, spherical alumina, ultrafine silica polyorganosiloxane and phenolic resin | — | 2012-05-15 |
| 7622515 | Composition of epoxy resin, phenolic resin, silicone compound, spherical alumina and ultrafine silica | — | 2009-11-24 |
| 7560821 | Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same | Takashi Yagisawa, Hiroyuki Yasuda | 2009-07-14 |