Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5504993 | Method of fabricating a printed circuit board power core using powdered ceramic materials in organic binders | Stanley R. Szerlip, Frances Planinsek, Robert D. Stroud | 1996-04-09 |
| 5469324 | Integrated decoupling capacitive core for a printed circuit board and method of making same | Watson R. Henderson, Stanley R. Szerlip | 1995-11-21 |
| 5448511 | Memory stack with an integrated interconnect and mounting structure | Stanley R. Szerlip | 1995-09-05 |
| 5428499 | Printed circuit board having integrated decoupling capacitive core with discrete elements | Stanley R. Szerlip, Archibald W. Smith | 1995-06-27 |
| 5273439 | Thermally conductive elastomeric interposer connection system | Stanley R. Szerlip | 1993-12-28 |
| 5274584 | Solid state memory device having optical data connections | Watson R. Henderson, Michael S. Kelly, Michael L. Leonhardt, Archibald W. Smith, Stanley R. Szerlip | 1993-12-28 |
| 5162977 | Printed circuit board having an integrated decoupling capacitive element | Archibald W. Smith, Stanley R. Szerlip | 1992-11-10 |