Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784104 | Method of forming electronic chip package having a conductive layer between a chip and a support | Olivier Ory | 2023-10-10 |
| 11158556 | Electronic chip package having a support and a conductive layer on the support | Olivier Ory | 2021-10-26 |