Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278155 | Integrated circuit package with heat sink and manufacturing method thereof | Younes BOUTALEB, Fabien Quercia, Ouafa HAJJI | 2025-04-15 |
| 12170262 | Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device | David Auchere, Fabien Quercia, Jerome Lopez | 2024-12-17 |
| 11557566 | Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device | David Auchere, Fabien Quercia, Jerome Lopez | 2023-01-17 |
| 10643970 | Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device | David Auchere, Fabien Quercia, Jerome Lopez | 2020-05-05 |
| 10224306 | Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device | David Auchere, Fabien Quercia, Jerome Lopez | 2019-03-05 |