Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10892291 | Bonding pad architecture using capacitive deep trench isolation (CDTI) structures for electrical connection | Sonarith Chhun | 2021-01-12 | $26,721,000 |