CL

Chia-Wei Li

SC Stcube & Co.: 6 patents #3 of 12Top 25%
University Of Texas System: 5 patents #550 of 6,559Top 9%
UT University Of Texas: 1 patents #37 of 278Top 15%
Overall (All Time): #544,216 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12057274 Packaging structures for electronic elements and solid electrolytic capacitor elements and methods thereof Yu-Peng Chung, Che-Chih Tsao 2024-08-06
12057275 Packaging of roll-type solid electrolytic capacitor elements Yu-Peng Chung, Wen-Cheng Hsu, En-Ming Chen, Che-Chih Tsao 2024-08-06
11981736 Antibodies specific to glycosylated PD-1 and methods of use thereof Stephen Sunghan Yoo, Ezra Myung Chul Chung, Yong-Soo Kim, Seung-Oe LIM, Mien-Chie Hung 2024-05-14
11933786 Antibodies specific to glycosylated PD-L1 and methods of use thereof Stephen Sunghan Yoo, Ezra Myung Chul Chung, Yong-Soo Kim, Mien-Chie Hung, Seung-Oe LIM 2024-03-19
11746152 Methods of cancer treatment and therapy using a combination of antibodies that bind glycosylated PD-L1 Stephen Sunghan Yoo, Mien-Chie Hung, Seung-Oe LIM 2023-09-05
11660352 Dual function antibodies specific to glycosylated PD-L1 and methods of use thereof Stephen Sunghan Yoo, Ezra Myung Chul Chung, Yong-Soo Kim, Kyu-Lee Han, Andrew H. Park +2 more 2023-05-30
10858432 Antibodies specific to glycosylated PD-1 and methods of use thereof Stephen Sunghan Yoo, Ezra Myung Chul Chung, Yong-Soo Kim, Seung-Oe LIM, Mien-Chie Hung 2020-12-08
10836827 Antibodies specific to glycosylated PD-L1 and methods of use thereof Stephen Sunghan Yoo, Ezra Myung Chul Chung, Yong-Soo Kim, Mien-Chie Hung, Seung-Oe LIM 2020-11-17
10679965 Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit Yen-Ni Hu 2020-06-09