Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8415786 | Thermally enhanced semiconductor package system | You Yang Ong, Zurina binti Zukiffly | 2013-04-09 |
| 8164182 | Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip | You Yang Ong, Zurina binti Zukiffly | 2012-04-24 |