PF

Po Yu Feng

SC Stats Chippac: 1 patents #282 of 425Top 70%
Overall (All Time): #3,251,572 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7952209 Integrated circuit package system with pad to pad bonding Cheng Yu Hsia 2011-05-31