Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4824803 | Multilayer metallization method for integrated circuits | Bonggi Kim, John E. Berg | 1989-04-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4824803 | Multilayer metallization method for integrated circuits | Bonggi Kim, John E. Berg | 1989-04-25 |