Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9972561 | QFN package with grooved leads | — | 2018-05-15 |
| 8222722 | Integrated circuit package and device | Nedyalko Slavov, Heinz-Peter Wirtz, Thomas Villiger | 2012-07-17 |
| 8125074 | Laminated substrate for an integrated circuit BGA package and printed circuit boards | Nedyalko Slavov, Heinz-Peter Wirtz | 2012-02-28 |