Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5310104 | Method and apparatus for cleaving a semiconductor wafer into individual die and providing for low stress die removal | Simon A. Zaidel, Brian Baxter, Albert J. Manoni | 1994-05-10 |
| 4525919 | Forming sub-micron electrodes by oblique deposition | — | 1985-07-02 |
| 4499656 | Deep mesa process for fabricating monolithic integrated Schottky barrier diode for millimeter wave mixers | Frank H. Spooner | 1985-02-19 |