Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7705351 | Flip chip semiconductor packaging device and testing method using first and second reflectors for determining gap between chip and circuit board or first and second chips | Nobuaki Ikebe, Toshiaki Iwafuchi, Yuji Yamagata | 2010-04-27 |