Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863282 | MEMS package, MEMS microphone and method of manufacturing the MEMS package | Masashi Shiraishi, Jumpei Tsuchiya, Lik Hang Wan, Toyotaka Kobayashi, Hironobu Hayashi | 2020-12-08 |
| 6284057 | Solder and soldering method | Osamu Asagi, Moriyuki Ebizuka, Kiyoshi Ichikawa | 2001-09-04 |
| 5871592 | Solder and soldering method | Osamu Asagi, Moriyuki Ebizuka, Kiyoshi Ichikawa | 1999-02-16 |