Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6395627 | Semiconductor device a burried wiring structure and process for fabricating the same | Takeshi Nogami | 2002-05-28 |
| 6265310 | Method of forming contact holes on a semiconductor surface | — | 2001-07-24 |
| 6114764 | Semiconductor device and process for fabricating the same | Takaaki Miyamoto | 2000-09-05 |
| 6111318 | Semiconductor device comprising Cu--Ta and method for forming the semiconductor device | — | 2000-08-29 |
| 5972786 | Contact hole structure in a semiconductor and formation method therefor | Yukiyasu Sugano | 1999-10-26 |
| 5792333 | Method of surface-roughening treatment of copper foil | Ryoichi Oguro, Tadao Nakaoka, Kazuyuki Inoue | 1998-08-11 |
| 5776830 | Process for fabricating connection structures | Hirofumi Sumi, Keiichi Maeda, Yukiyasu Sugano, Kazuhide Koyama, Mitsuru Taguchi | 1998-07-07 |
| 5532600 | Method of and apparatus for evaluating reliability of metal interconnect | — | 1996-07-02 |
| 5444182 | Wire harness connector cover | — | 1995-08-22 |
| 5430258 | Copper interconnection structure and method of preparing same | — | 1995-07-04 |
| 5315062 | Wire harness connector cover | — | 1994-05-24 |
| 4985750 | Semiconductor device using copper metallization | — | 1991-01-15 |
| 4910169 | Method of producing semiconductor device | — | 1990-03-20 |