Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847136 | Conversion gain modulation using charge sharing pixel | Thomas R. Ayers, Jinsuk Kang, Sungin Hwang, Sen Yu | 2014-09-30 |
| 8389370 | Radiation-tolerant integrated circuit device and method for fabricating | Nadim F. Haddad, Jonathon Maimon | 2013-03-05 |
| 8194178 | Programmable micro-electromechanical microshutter array | Robert M. Guidash, J. Kelly Lee, Marek W. Kowarz, Robert Andosca | 2012-06-05 |
| 8119435 | Wafer level processing for backside illuminated image sensors | — | 2012-02-21 |
| 8076170 | Backside illuminated image sensor with shallow backside trench for photodiode isolation | — | 2011-12-13 |
| 8017426 | Color filter array alignment mark formation in backside illuminated image sensors | — | 2011-09-13 |
| 7915067 | Backside illuminated image sensor with reduced dark current | John P. McCarten | 2011-03-29 |
| 7879638 | Backside illuminated imager and method of fabricating the same | — | 2011-02-01 |
| 7859033 | Wafer level processing for backside illuminated sensors | — | 2010-12-28 |
| 7821046 | Methods, structures and sytems for an image sensor device for improving quantum efficiency of red pixels | — | 2010-10-26 |
| 7763913 | Imaging method, apparatus, and system providing improved imager quantum efficiency | Xiaofeng Fan | 2010-07-27 |
| 7432121 | Isolation process and structure for CMOS imagers | Inna Patrick | 2008-10-07 |
| 6841861 | MEMS package | — | 2005-01-11 |
| 6794733 | Increasing the susceptability of an integrated circuit to ionizing radiation | Murty S. Polavarapu | 2004-09-21 |
| 6762128 | Apparatus and method for manufacturing a semiconductor circuit | Paul A. Bernkopf, Nadim F. Haddad | 2004-07-13 |
| 6716728 | Radiation hardened silicon-on-insulator (SOI) transistor having a body contact | Robert Charles Dockerty, Nadim F. Haddad, Michael Hurt | 2004-04-06 |
| 6665161 | Semiconductor circuit having increased susceptibility to ionizing radiation | Murty S. Polavarapu | 2003-12-16 |
| 6660564 | Wafer-level through-wafer packaging process for MEMS and MEMS package produced thereby | — | 2003-12-09 |
| 6638832 | Elimination of narrow device width effects in complementary metal oxide semiconductor (CMOS) devices | Jon Maimon | 2003-10-28 |
| 6441440 | Semiconductor device and circuit having low tolerance to ionizing radiation | Nadim F. Haddad, Murty S. Polavarapu | 2002-08-27 |
| 6399989 | Radiation hardened silicon-on-insulator (SOI) transistor having a body contact | Robert Charles Dockerty, Nadim F. Haddad, Michael Hurt | 2002-06-04 |
| 6034399 | Electrostatic discharge protection for silicon-on-insulator | Robert Christian Bertin | 2000-03-07 |
| 5527724 | Method to prevent latch-up and improve breakdown volatge in SOI mosfets | Nadim F. Haddad, Arthur Edenfeld | 1996-06-18 |
| 5360752 | Method to radiation harden the buried oxide in silicon-on-insulator structures | Nadim F. Haddad | 1994-11-01 |
| 5358879 | Method of making gate overlapped lightly doped drain for buried channel devices | Charles P. Breiten, Nadium F. Haddad, William G. Houston, Oliver S. Spencer, Steven Wright | 1994-10-25 |