Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096564 | Manufacturing method of semiconductor package | Toshiyuki INAOKA | 2018-10-09 |
| 10079161 | Method for producing a semiconductor package | Toshiyuki INAOKA, Yuichiro Yoshikawa, Katsushi YOSHIMITSU | 2018-09-18 |
| 9717142 | Multilayer wiring substrate, method of producing the same, and semiconductor product | Toshiyuki INAOKA | 2017-07-25 |
| 8604346 | Flex-rigid wiring board and method for manufacturing the same | — | 2013-12-10 |
| 7223349 | Method and apparatus for surface processing of printed wiring board | Tatsutoshi Narita, Masanobu Yagi, Yoshiyuki Ukeda | 2007-05-29 |
| 6878296 | Method and apparatus for surface processing of printed wiring board | Tatsutoshi Narita, Masanobu Yagi, Yoshiyuki Ukeda | 2005-04-12 |
| 6673194 | Method and apparatus for surface processing of printed wiring board | Tatsutoshi Narita, Masanobu Yagi, Yoshiyuki Ukeda | 2004-01-06 |