Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032738 | Method for forming bump of semiconductor package | Hyun Chul Jung | 2018-07-24 |
| 7956450 | Multi-chip package | — | 2011-06-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032738 | Method for forming bump of semiconductor package | Hyun Chul Jung | 2018-07-24 |
| 7956450 | Multi-chip package | — | 2011-06-07 |